Description
New upgraded LY 1002 auto BGA mobile IC router chipset repair CNC Milling Polishing Engraving Machine for iPhone Main Board chip maintance
Reference Videos :
https://www.youtube.com/watch?v=MHwZrnaLhhc&feature=youtu.be |
https://www.youtube.com/watch?v=uOF1kI3wmgc&feature=youtu.be |
Introduction
Perfectly combined producs of BGA & CNC. CNC tech applied in BGA repair industry, make mobile repairing become more easier for CNC field users, can get more broad apply area
This item is perfect to grind and remove the CUP, HHD, WIFI, FONT chips in iPhone series mobile phone without any damage in the board. It is effective machine to help you repair the iPhone 6/6P/6S/6SP/7/7P/8/8P/X and ipad……. You can use the soldering station to solder a good chip in the board after grinding. Great grinding machine in mobile phone repairing and refurbishing
1 year machine part and 6 months electrical parts,stepping motor,spindle Free Warranty
Technical Parameters
Machine Dimensions: | 580X560X750mm |
Mould size: | 150X135 mm |
Engraving area: | 200X100X100 mm |
Rail type: | Linear guide |
Type of screw: | Ball screw 1605, Pitch 4mm |
Spindle motor: | 800W water cooling spindle , 0-24000r/min |
Collet type: | ER11,1/8"(3.175mm) Collet |
Repeat positioning Accuracy: | 0.01mm |
Communication interface: | Not need computer/ SD Card / HD camera. |
Software Compatability: | Firmware v1.o |
Machine weight: | 78kg |
Package size | 600*600*800mm |
The machine already assembled & tested well, can directly use after take them out from package !
Product advantage:
a. Easy for learn and use
b. Intelligent system
c. Automatic detection
d. Visual design
e. high precision
f. SD card storage
Packing list:
Mould x 9 pcs for IP( 6/6P/6S/6SP/7/7P/8/8P/X, Size:150*135mm) with relative files
Power cord x 1
Ground wire x 1
Drill tips x 1 box(50pcs)
Allen wrench x 1
Spindle wrech x 2
Dust blower x 1
Reviews
There are no reviews yet.